HRT 3000 - Non-Contact Optical Profilometer
Applications: Semiconductor, Electronic Device and Packaging, Optics, Flat Panel Display, LED, MEMS, Hard Disk Drive
HRT 3000 - Non-Contact Optical Profilometer
The HRT 3000 is a non-contact profilometer designed specifically to measure high aspect ratio trenches found in semiconductors and MEMS devices. The many features built into the HRT 3000 make it very flexible and allow it to operate in production as well as research environments. The software is both simple to use and powerful enough to solve numerous metrology problems.
Some of the many applications Tamar has addressed with the HRT 3000 are:
High Aspect Ratio Trenches depth and width for semiconductors
MEMS etch depth and width
Fresnel lens step measurement
Surface profile of optical components and crystals
Solder bumps and micro bumps.
Micro-fluidic chips
Flat Panel Display Photo Spacer Height
Flat Panel Display Layer Thickness
In addition to our standard HRT 3000, we routinely build specific configurations to solve specific applications.
HRT3000 Specifications
Objective Lens
Height Range (um)
Spot Size (um)
Height resolution (um)
5x
2000
15
0.5
10x
1000
11
0.1
20x
250
5
0.05
50x
40
2
0.01
Scan rates from .001 mm/sec to 25 mm/sec
Scan distance up to 100 mm
Samples rates 2 ms minimum
Dynamic range 40dB
Scans in any direction
Dynamic integration option during scan
Live video during scan
High/Low pass filtering of data option before calculations
Automatically calculated ANSI standard roughness/waviness
Numerous other calculations available
Raw Data export for offline processing
WaferScan – Wafer Bow & Warp Geometry
WaferScan is a big step forward in wafer thickness metrology. WaferScan utilizes Tamar's proprietary Optical Stylus (patent pending) technology to measure the thickness, warp, bow and other shape features of wafers, with high data density and high throughput. WaferScan allows the user to acquire thousands of data points on the surface and can measure thickness of conventional wafers as well as thin wafers and of any material. No optical constants are required and patterned or bumped wafers are easily addressed.
WaferScan Specifications
Measure Modes
Scanning Mode for wafer thickness and wafer shape metrology
Scan Mode for bump coplanarity
Step Mode for bump height and vision X-Y measurements of bump diameter and shape
Stage Resolution
0.1 um (optional 0.05 um)
Objective Lenses
5x, 10x, 20x
Measurement Range
10 - 2000 um
Micro bumps 15 - 25 micron use 20X, Standard bumps 250 micron range, use 5X
Optional Features
Fully Automatic Wafer or Substrate Handling
Bar code, serial number readers
Automated alignment
Optical Stylus Probe
Single sided measurements for thin wafers uses Optical Stylus Probe Only
Dual sided measurement for Thick wafers & Etch Residual Thickness
Bump applications use single side Optical Stylus Probe with video microscope attachment
Tamar Technology offers precision metrology and automated inspection systems to the semiconductor, MEMS, FPD, LED and Medical device industries, as well as other high technology industries, using proprietary Machine Vision and Optical Stylus Probe Technologies Machine Vision Tamar enhances our customer’s productivity by supplying precision metrology systems for CD measure and many application specific systems. Optical Profilometry Tamar’s proprietary Optical Stylus (patent pending) technology is used in the HRT 3000 profilometer as well as WaferScan for wafer thickness metrology.
