Designed to eliminate inking process during 2nd optical inspection and provide wafer mapping capability with capable of sending data to pick and place machine.
Creden's ISP Products is specially designed to handle leadframe and substrate for visual inspection after die attach and wire bonding process. With the concept of hand-free and non frame-jam, the simple and high reliable loader and handler enables the leadframe or substrate clamped firmly on the programmable XY indexing table throughout the whole inspection process.
2ND OPTICAL INSPECTION SYSTEM
DESCRIPTION:
Designed to eliminate inking process during 2nd optical inspection and provide wafer mapping capability with capable of sending data to pick and place machine.
GENERAL FEATURES:
。Designed for ‘inkless assembly ‘in 2nd optical inspection process.
。Capable to handle wafer size from 4” to 12” wafer.
。Provide semi-auto loading and unloading for sawn and un-sawn wafer platform.
。Programmable XY indexing for wafer-die devices inspection.
。Visual inspection and defect classification for sawn and un-sawn wafer.
。Provided wafer mapping capability to wafer map data management and integration in inkless assembly of semiconductors.
。Network LAN ready with TCP platform.
。Advanced data management:
-Easy-to-use GUI system setup and working environment
-Standard map system provide
-Conversion of wafer maps
-Automated or On-demand retrieval map from / to database
-Editing wafer maps and other wafer information
3RD OPTICAL INSPECTION SYSTEM
DESCRIPTION:
Creden's ISP Products is specially designed to handle leadframe and substrate for visual inspection after die attach and wire bonding process. With the concept of hand-free and non frame-jam, the simple and high reliable loader and handler enables the leadframe or substrate clamped firmly on the programmable XY indexing table throughout the whole inspection process.
GENERAL FEATURES:
。Designed to handle leadframe and substrate for visual inspection after die attach and wire bonding process.
。Simple and reliable unloader / loader and handler enable the leadframe or substrate clamped firmly on the programmable XY indexing table.
。Machine designed with the concept of eliminating frame-jam and frame-damage protection devices. 。Programmable XY Indexing with up to 25 micron accuracy.
。East-to-use GUI system setup and working environment.
。Recipe Setup Management: 1 st version: MC-II (original version) and 2 nd version: ISP-CONTROL (upgrade version), features include:
-Smart and fast setup
-Summary parameter setting
-100% inspection, random sampling and custom define inspection
-Allows up to 1000 inspection result classification
-Operational Inspection Mode selection between Manual or Auto Inspection Mode
-Live image capture
-Report summary is available in viewing and printing mode so as to monitor the process yield
-Report printing in summary format or in frame map graphic format
-Maintenance mode
CREDEN Group of Companies incorporated on 1998, is a subsidiary of QES to provide engineering and OEM manufacturing services to worldwide semiconductor industries. CREDEN Mechatronic Sdn Bhd, is a pioneer status company specializing in manufacturing and assembly of semiconductor test and inspection equipment, such as Optical based inspection systems (3rd Optical and 2nd Optical) Auto-mold, Laser Mark, Singulations and Strip Test handlers, as well as OEM sub-system and components.
