The cell assembly process joins an array substrate with a color filter substrate and files the space between them with liquid crytal. Cleaning System LC 2700 series:An original slope transfer system achieves high throughput of 1950mm x 2250mm substrates, and BBS(Building Block System) offers flexible configuration and easy maintenance. Cell Assembling- Gap Forming System AE/AG6000 A high speed, precision assembly and gap forming line for 5th generation 1200mm x 1350mm substrate. Process cells in 40 seconds

Hitachi High-Technologies was formed in 2001 through a merger of three companies that created a unique combination of manufacturing, sales, and service capabilities. The Instruments Group of Hitachi, Ltd. brought an established reputation in measuring technologies; the Semiconductor Manufacturing Equipments Group of Hitachi, Ltd. supported the efficiency of technology and the realization of more sophisticated performance; and Nissei Sangyo Co., Ltd., provided both a trading function specialized in cutting edge technology, with a focus on electronic products, and the ability to construct new businesses based on its global network. Further mergers added the chip mounter business in 2003 and the flat panel and hard disk related manufacturing systems experience of Hitachi Electronics Engineering Co., Ltd. in 2004. Hitachi High-Technologies now aims to be the global leader in high-tech solutions in its four business segments: electronic device systems, life sciences, information systems and electronic components, and advanced industrial components.