The cell assembly process joins an array substrate with a color filter substrate and files the space between them with liquid crytal. Cleaning System LC 2700 series:An original slope transfer system achieves high throughput of 1950mm x 2250mm substrates, and BBS(Building Block System) offers flexible configuration and easy maintenance. Cell Assembling- Gap Forming System AE/AG6000 A high speed, precision assembly and gap forming line for 5th generation 1200mm x 1350mm substrate. Process cells in 40 seconds

With the hurtling pace of technological advances here at the dawn of the twenty-first century, what is the key to staying ahead? Want an answer? Just watch the fusion of Hitachi's advanced technologies and product development capabilities with Nissei Sangyo's global sales force. Combining the strengths of these two companies will generate synergies that create an unprecedented new force in the market-Hitachi High-Technologies Corporation. The new company will be established on October 1, 2001 through an integration of Nissei Sangyo Co., Ltd., with Hitachi's Instruments Group and Semiconductor Manufacturing Equipment Group. Augmenting Nissei Sangyo's identity as a high-tech trading company, the new Hitachi High-Technologies will be an integrated organization that develops, manufactures, markets and services equipment and systems in the emerging field of nanotechnology. Hitachi High-Technologies will anticipate the needs of the next generation as no high-tech company ever has. Now, for the future-Hitachi High-Technologies.