In the module assembly process, drivers and other electronics to a panel received from the cell process, and the panel is tested for visual defects.
In the module assembly process, drivers and other electronics to a panel received from the cell process, and the panel is tested for visual defects.
AL6120-AL6150 Automatic system for TAB or COF bonding
AB6020-AB6050 Automatic system for PCB bonding
**Lineup for 47,42,37 inches size
**Drastic improvement of efficiency production
AX 1000 Multi-Function Bonder
With the hurtling pace of technological advances here at the dawn of the twenty-first century, what is the key to staying ahead? Want an answer? Just watch the fusion of Hitachi's advanced technologies and product development capabilities with Nissei Sangyo's global sales force.
Combining the strengths of these two companies will generate synergies that create an unprecedented new force in the market-Hitachi High-Technologies Corporation.
The new company will be established on October 1, 2001 through an integration of Nissei Sangyo Co., Ltd., with Hitachi's Instruments Group and Semiconductor Manufacturing Equipment Group. Augmenting Nissei Sangyo's identity as a high-tech trading company, the new Hitachi High-Technologies will be an integrated organization that develops, manufactures, markets and services equipment and systems in the emerging field of nanotechnology. Hitachi High-Technologies will anticipate the needs of the next generation as no high-tech company ever has.
Now, for the future-Hitachi High-Technologies.
