In the module assembly process, drivers and other electronics to a panel received from the cell process, and the panel is tested for visual defects. AL6120-AL6150 Automatic system for TAB or COF bonding AB6020-AB6050 Automatic system for PCB bonding **Lineup for 47,42,37 inches size **Drastic improvement of efficiency production AX 1000 Multi-Function Bonder

Hitachi High-Technologies was formed in 2001 through a merger of three companies that created a unique combination of manufacturing, sales, and service capabilities. The Instruments Group of Hitachi, Ltd. brought an established reputation in measuring technologies; the Semiconductor Manufacturing Equipments Group of Hitachi, Ltd. supported the efficiency of technology and the realization of more sophisticated performance; and Nissei Sangyo Co., Ltd., provided both a trading function specialized in cutting edge technology, with a focus on electronic products, and the ability to construct new businesses based on its global network. Further mergers added the chip mounter business in 2003 and the flat panel and hard disk related manufacturing systems experience of Hitachi Electronics Engineering Co., Ltd. in 2004. Hitachi High-Technologies now aims to be the global leader in high-tech solutions in its four business segments: electronic device systems, life sciences, information systems and electronic components, and advanced industrial components.