LC 2700 series:An original slope transfer system achieves high throughput of 1950mm x 2250mm substrates, and BBS (Building Block System) offers flexible configuration and easy maintenance
Exposure system for large size glass substrate
LE0100S for 7th generation 1950mm x 2250mm glass substrates.
LE9300S for 6th generation 1500mm x 1850mm glass substrates.
LE9100S for 5th generation 1100mm x 1300mm glass substrates.
LE8000A
LE5565A
LE4000A
Wet process system for large size glass substrate to combine a cost-saving design to reduce chemical consumption 20%. With a new etching module EPD(End Point Detector) for improved reliability and performance.
LY 2700 Organic Solvent Processor for 7th generation 1950mm x 2250mm glass substrates.
LN 2700 Wet acid Processor for 7th generation 1950mm x 2250mm glass substrates.
LK 2700 Wet Alkali Processor for 7th generation 1950mm x 2250mm glass substrates.
Cleaning System
LC 2700 series:An original slope transfer system achieves high throughput of 1950mm x 2250mm substrates, and BBS (Building Block System) offers flexible configuration and easy maintenance
Hitachi High-Technologies was formed in 2001 through a merger of three companies that created a unique combination of manufacturing, sales, and service capabilities. The Instruments Group of Hitachi, Ltd. brought an established reputation in measuring technologies; the Semiconductor Manufacturing Equipments Group of Hitachi, Ltd. supported the efficiency of technology and the realization of more sophisticated performance; and Nissei Sangyo Co., Ltd., provided both a trading function specialized in cutting edge technology, with a focus on electronic products, and the ability to construct new businesses based on its global network. Further mergers added the chip mounter business in 2003 and the flat panel and hard disk related manufacturing systems experience of Hitachi Electronics Engineering Co., Ltd. in 2004. Hitachi High-Technologies now aims to be the global leader in high-tech solutions in its four business segments: electronic device systems, life sciences, information systems and electronic components, and advanced industrial components.