產品特色: 可對應或結合各種鍍膜技術 : 物理氣相沈積 (PVD) 電漿增強化學氣相沈積 (PECVD) 磁控濺鍍 (Magnetron Sputtering) 電子束蒸鍍 (Electron Beam Deposition) 離子束增強沈積 (Ion Beam Enhanced Deposition) 離子輔助沈積 (Ion Assisted Deposition) 電漿清洗 (Plasma Sterilization) 反應式/熱蒸鍍 (Reactive / Thermal Deposition) 離子束濺鍍 (Sputtering) 反應式離子蝕刻 (Reactive Ion Etching) 主要市場應用 : 精密光學 眼鏡鍍膜 電子 光電 通訊 半導體 薄膜研發 樣品製備 熱成像 太陽能 OLED 顯示器 應用範例: Example 1: CIGS R&D/pilot run turn-key system ：客製化 Cluster type – 結合蒸鍍/ 濺鍍鍍膜系統 Example 2: c-Si solar wafer cell HIT(Heterojunction with Intrinsic Thin layer)鍍膜系統：EXPLORER 結合 PECVD / Sputter 鍍膜系統 Example 3. SEM sample preparation coating 蒸鍍system :　 DV-502B (for bio research, material science research, electronic research…) Example 4 結合電漿蝕刻清洗與濺鍍鍍膜系統：PHOENIX 400　 在Wafer 上先做電漿蝕刻清洗, 再鍍其他金屬層 SYSTEM TECHNOLOGY SUBSTRATE SIZE CHAMBER SIZE R & D BATCH PRODUCTION IN-LINE PRODUCTION DESK Sputtering Up to 4" 6" Dia. 　* 　 　 DESKTOP PRO Sputtering Up to 4" 10" Dia. x 10" H 　* 　 　 BENCH TOP TURBO PVD Up to 6" Bell Jar up to 12" Dia. x 18" H 　* 　 　 Sputtering DV-502B PVD Up to 6" Bell Jar up to 12" Dia. x 18" H 　* 　 　 EXPLORER PECVD Up to 10" 20" H x 20" W x 20" D or Bell Jar up to 12" Dia. x 18" H 　* 　* 　 PVD Sputtering VOYAGER PECVD Up to 10" Up to 24" 　* 　* 　 Sputtering DISCOVERY Sputtering Up to 12" Up to 30" * * 　 DISCOVERY HDG PVD Up to 8" 26" Dia. x 30" W * 　 　 Ion Beam Etching PHOENIX 400 Sputtering Up to 24" Custom 　* 　 　* HELIOS PECVD Up to 39" Up to 44" 　 　* 　 INTEGRITY PVD Custom Custom 　 　* 　 PHOENIX PECVD Up to 31" x 61" Up to 80" 　 　 　* PVD Sputtering

Denton Vacuum • 1964年成立，超過 45年薄膜技術專業。 • 已安裝超過 5000 套系統。 • 鍍膜技術包括PVD, PECVD, Magnetron Sputtering, Electron Beam Deposition, Ion Beam Enhanced Deposition, Ion Assisted Deposition, Plasma Sterilization, Reactive / Thermal Deposition, Sputtering and Reactive Ion Etching。