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Applications |
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AXOMETRICS
Imaging Spectroscopic Ellipsometer
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Use rotating Compensator (PSCA) configuration ellipsometer with 16-bit CCD camera to measure thickness, optical constants n and k value of thin films
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FSM 128/500/900
Film Stress Measuring System |
Applied to measuring the uniformity, thickness, and residual stress of film after film deposition process |
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FSM 413 /8108
Multiple Layer Thickness Measuring System |
Semiconsoft, Electronics, LED, FPD, Solar cell, MEMS |
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HISOL
Manual Prober |
semiconductor R&D, electric failure analysis and manual circuit probing system |
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Hitachi Power Solutions
Scanning Acoustic Tomograph |
FC bump soldering quality to check with bump crack or underfill with void or not, or BGA, Leadframe package, post molding to check mold compound with delamination or not |
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INSIDIX
Thermal Deformation Measuring System |
electronics, semiconductors and other products |
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KOH YOUNG
3D automatic optical inspection |
Semiconductor, SMT, automotive, topography, optical, medicine.
3D measurement inspection solutions for diverse production environment. |
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RADIANT
Laser De-capsulation System |
remove the mold compound |
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SURAGUS
Wafer metal layer resistance \ thickness measuremen |
Germany,Suragus,Providing testing solutions for non-destructive material. |
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XYZTEC
Bond Tester |
Post wafer bumping, die attachment, wire bond, or BGA balling to check the connections or bonding strength and monitoring the process. |
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YXLON. International
X-ray Inspection System |
quality control,monitoring post IC packaging, Lab. analysis , also can be used in PCBA, ceramic, LED, solar chip packaging |
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